How to use steam solder correctly and appropriately


Steam solder Uap is a variant of solder. Commonly called, hot water blower due to the use of air system usage. There are 2 settings in the standard blower. The first setting is the heat (heating) capability that can be passed through the solder’s eye. The second setting is the pressure (emission ability) of air that can be emitted. These 2 regulators work linearly with each other. The higher the temperature of the air emitted, can be stronger again when raised air pressure that can be issued.

Steam solder function

Steam solder works for; lifting, placing, printing and re-soldering components / IC; either IC SMD, BGA (tin balls) or other small components.

The system of soldering back or heating the foot IC is to repair IC legs that may be less attached to the PCB and not just to repair the damaged IC. Temperature and air pressure from steam solder should be adjusted so as not to cause PCB damage.

The steam solder holding step must be strong and perpendicular to the IC component for soldering purpose.

How to use steam solder

Use of this blower is quite simple. In the component system application, the step of holding the blower is exactly the same as the usual solder holding step. The main advantages of this blower is melt tin with air released, not just with iron rods used in regular solder. Use the solder in the following way:

First plug the blower cable into the mains and press the power button so that the blower position is alive.

After the blower runs we can adjust the settings on the blower.

In general there are two settings, namely the regulation of heat and air pressure settings coming out from the blower.

Turn the heat setting at the right temperature, like 200 ̊C. Temperature of 200 degrees can be produced, but no longer felt on the tip of the solder when the air pressure released is positioned.

For a digital blower, set the temperature simply by pressing the up and down buttons. In manual steam soldering the air pressure is adjusted by rotating.

Adjust the air pressure as we wish, default to position 1, 2, 3 or the other.

Air 200 degrees can be exhaled and can be felt the heat released. In a situation like above, blowers can be used for the purposes of the desired.

The use of blower is very dependent on the type of device that can be soldered, because it can be much related to the setting of heat and air pressure from the blower.

Some rules of heat and air pressure blower:

• Eliminate liquid (dry) 100-200 degrees, air pressure 8 (toned)
• Heat / melt lead from top position 350-400 degrees, air pressure 3 (very slow)
• Heat / melt the lead from the lower position of 350-400 degrees, air pressure 3 (very slow)

• Lifting and placing components 350-400 degrees, air pressure 3 (very slow)

• Lifting flexible from PCB 250-300 degree, air pressure 3 (very slow)
• Lifting plastic components 250-275 degrees, air pressure 3 (very slow)
• Printed foot IC 350-400 degrees, air pressure 3 (very slow)


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